Ausschreibungen

Fraunhofer IMS requires a new or refurbished fully automated electroplating system. In this system 8” (200 mm) wafers can be processed according to the specifications below. Optional: The system can be easily changed to process wafer size 6”. The wafers are loaded automatically by a robot handler from cassette to cassette. The system consists at least of 4 electroplating modules for 4 different electrolytes Cu, Ni, Au and Sn, a Prewet/Spin Rinse module, a module for UBM (under bump metallization) removal and one module for the promotion of Ni-Au adhesion. Modules for TSV copper process (i.e. additional vacuum prewet module) must be available optional for this system. Optional: a waste disposal system for heavy metal waste for the UBM removal module. The system includes software which offers the option of an operating mode and a manual mode for engineering. The system includes an interface for a fully automated plating bath analyse equipment for every electrolyte Next II.2.4):

1 pc. fully automated electroplating system

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Ausschreibungen zum Thema Electroplating machines