UHV Bonder

We are interested in acquiring a high vacuum bonder for research into ultra-high vacuum encapsulation in MEMS-like systems. This research will provide us with the capability to produce miniature vacuum chambers for use in quantum enabled devices in which ultra-cold matter is used for timing, navigation, and sensing applications. The bonder will also be used for the fabrication of miniature vapour cells for use in chip-scale atomic clocks. These devices require low temperature bonding techniques (such as Anodic, Eutectic, Direct and Frit) in ultra-low residual gas environments.
CPV-Code: 38810000
Abgabefrist:
Typ: Contract award notice
Status: Not applicable
Aufgabe: Education
Vergabestelle:
name: University of Southampton
address: Highfield Road
postal_code: SO17 1BJ
city: Southampton - UK
country: UK
email: None
phone: +44 2380594088
contact_point: https://in-tendhost.co.uk/universityofsouthampton
idate: 10. Juni 2020 22:35
udate: 10. Juni 2020 22:35
doc: 147528_2015.xml
authority_types: BODY_PUBLIC
activities: EDUCATION
Quelle: http://ted.europa.eu/udl?uri=TED:NOTICE:147528-2015:TEXT:EN:HTML
Unterlagen: None
Zuschlagskriterium: Not specified
Vertrag: Supplies
Prozedur: Not specified
Nuts: None
Veröffentlichung: 29.04.2015
Erfüllungsort: Southampton - GB
Link:
Lose:
Name Los Nr 1 UHV Bonder
Gewinner Applied Microengineering LTD
Datum
Wert None
Anzahl Angebote 2