Deposition Tools

- An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide - A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
CPV-Code: 38000000
Abgabefrist:
Typ: Contract award notice
Status: Not applicable
Aufgabe: Education
Vergabestelle:
name: Cardiff University
address: Procurement Services, McKenzie House, 30-36 Newport Road
postal_code: CF24 0DE
city: Cardiff - UK
country: UK
email: None
phone: +44 2920879648
contact_point:
idate: 29. März 2022 10:21
udate: 29. März 2022 10:21
doc: 164655_2022.xml
authority_types:
activities:
Quelle: https://ted.europa.eu/udl?uri=TED:NOTICE:164655-2022:TEXT:EN:HTML
Unterlagen: None
Zuschlagskriterium: The most economic tender
Vertrag: Supplies
Prozedur: Open procedure
Nuts: None
Veröffentlichung: 29.03.2022
Erfüllungsort: Cardiff -
Link:
Lose:
Name Los Nr 1 None
Gewinner SPTS Technologies Ltd
Datum
Wert GB£1 666 666,00
Anzahl Angebote 1