The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As part of the package assembly research and development methodology we require a machine to perform submicron die placement for several growth areas in compound semiconductor packaging. This machine shall be capable of handling very small die in applications where their precision placement is a high priority; typical examples of this are micro LED’s, laser diode assembly, micro optics assembly, VCSEL, photo diode arrays, III-V semiconductor die attachment to ROIC (hybridisation) and image sensor assembly.
| CPV-Code: |
31710000
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| Abgabefrist: |
13.08.2020 |
| Typ: |
Contract notice |
| Status: |
Submission for all lots |
| Aufgabe: |
Other |
| Vergabestelle: |
| name: |
Compound Semiconductor Applications Catapult |
| address: |
CSA Catapult Innovation Centre Celtic Way Imperial Park |
| postal_code: |
NP10 8BE |
| city: |
Newport - UK |
| country: |
UK |
| email: |
None |
| phone: |
None |
| contact_point: |
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| idate: |
1. August 2020 03:30 |
| udate: |
1. August 2020 03:30 |
| doc: |
338101_2020.xml |
| authority_types: |
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| activities: |
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| Quelle: |
http://ted.europa.eu/udl?uri=TED:NOTICE:338101-2020:TEXT:EN:HTML |
| Unterlagen: |
https://csa.catapult.org.uk |
| Zuschlagskriterium: |
The most economic tender |
| Vertrag: |
Supplies |
| Prozedur: |
Open procedure |
| Nuts: |
None |
| Veröffentlichung: |
17.07.2020 |
| Erfüllungsort: |
Newport - GB |
| Link: |
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| Lose: |
| Name |
Los Nr 0 |
| Gewinner |
None |
| Datum |
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| Wert |
None |
| Anzahl Angebote |
None |
| Name |
Los Nr 1 United Kingdom__Newport__Elektronische Ausstattung |
| Gewinner |
None |
| Datum |
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| Wert |
None |
| Anzahl Angebote |
None |
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