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Thermal Imaging IR Camera System

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.

CPV-Code:

31720000

Abgabefrist:

27.11.2020

Typ:

Contract notice

Status:

Submission for all lots

Aufgabe:

Other

Vergabestelle:

name:	Compound Semiconductor Applications Catapult
address:	CSA Catapult Innovation Centre Celtic Way Imperial Park
postal_code:	NP10 8BE
city:	Newport - UK
country:	UK
email:	None
phone:	None
contact_point:
idate:	17. November 2020 10:00
udate:	17. November 2020 10:00
doc:	551969_2020.xml
authority_types:
activities:

Quelle:

http://ted.europa.eu/udl?uri=TED:NOTICE:551969-2020:TEXT:EN:HTML

Unterlagen:

http://csa.catapult.org.uk

Zuschlagskriterium:

The most economic tender

Vertrag:

Supplies

Prozedur:

Open procedure

Nuts:

None

Veröffentlichung:

17.11.2020

Erfüllungsort:

Newport -

Link:

Lose:

Name	Los Nr 1 United Kingdom__Newport__Elektromechanische Ausrüstung
Gewinner	None
Datum
Wert	None
Anzahl Angebote	None

Thermal Imaging IR Camera System

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