ICP RIE ETCHER and PECVD

The ICP RIE and PECVD systems will be purchased as part of the Interreg North West Europe OIP4NWE program. This program has been set up to bring the production of Photonic Integrated Circuits in InP to a TRL of 7. Therefore the need of a Wafer loading system with direct loading from a standard 3" and 4" cassette system.
CPV-Code: 38000000
Abgabefrist:
Typ: Contract award notice
Status: Not applicable
Aufgabe: Education
Vergabestelle:
name: Technische Universiteit Eindhoven
address: Postbus 513
postal_code: 5600 MB
city: Eindhoven - NL
country: NL
email: None
phone: None
contact_point: Christ van der Aalst
idate: 20. November 2020 10:06
udate: 20. November 2020 10:06
doc: 557426_2020.xml
authority_types:
activities:
Quelle: http://ted.europa.eu/udl?uri=TED:NOTICE:557426-2020:TEXT:EN:HTML
Unterlagen: None
Zuschlagskriterium: The most economic tender
Vertrag: Supplies
Prozedur: Open procedure
Nuts: None
Veröffentlichung: 20.11.2020
Erfüllungsort: Eindhoven -
Link:
Lose:
Name Los Nr 1 None
Gewinner SPTS Technologies Ltd
Datum
Wert 1,00 €
Anzahl Angebote 2